DMIP 2021 with the theme of “Digital Media, Information Processing”, is a
premier forum for the presentation of technological advances and research
results in the fields of digital media and information processing in daily
life. It will bring together leading engineers and scientists in graphics
and image processing, network communications, and computer technologies from
around the world. It will be a platform for communication and share of the
cutting-edge ideas and technologies in digital home development.
The conference sets with different roles. The International Technical Committee is in charge of paper review. The Organizing Committee with the SCIEI conference management department are in charge of the preparation, organization and operation of the conference.
Looking forward to seeing you onsite the conference DMIP 2021, Xiamen, China.
|Paper/Publication submission deadline
Abstract/ Presentation submission deadline
April 10, 2021
April 10, 2021
|Paper/Publication acceptance notification
Abstract/ Presentation acceptance notification
|April 30, 2021
Five working days
|May 15, 2021
September 10, 2021
All the papers will be peer reviewed by experts. The review result comes out in 15 to 20 days.
Accepted and presented papers will be published by Conference Proceedings. Published papers are expected to be submitted for inclusion into EI Compendex, Scopus and other academical databases etc.
Accepted and registered papers of DMIP 2020 were published online in proceedings. It's indexed by EI Compendex and SCOPUS within two months after online.(More)
Accepted papers of DMIP were published in Proceedings. It's online and indexed by EI Compendex, SCOPUS within three month after online and successfully indexed by ISTP/CPCI (Web of Science) (More)
|Kang||Zhang||University of Texas at Dallas||US|
|Jianhong||Zhou||University of Electronic Science and Technology of China||CN|
|Emanuel||Grant||University of North Dakota||US|
|Yonglei||Tao||Grand Valley State University||US|
|Special Sessions Chair|
|Renne||Gao||Science and Engineering Institute||US|
© DMIP 2019-2021 | Xiamen, China | Email: firstname.lastname@example.org